Brief: Discover the advanced BGA PCB Printed Circuit Board Assembly Services Process in China. Our high-density, high-performance BGA PCBs feature immersion gold finish, precise testing, and superior thermal conductivity for optimal electronic performance.
Related Product Features:
Material: Fr4 1.6mm with 6 layers for durability and reliability.
Surface finish: Immersion gold for enhanced conductivity and corrosion resistance.
तांबे का भारः 70UM जो कि विद्युत क्षमता को सुनिश्चित करता है।
Assembly components: IC chips with 484 footprint for high-density integration.
Testing: X-Ray inspection for quality assurance.
Min line width and space: 3mil for precision and compact design.
Solder mask and silkscreen included for protection and labeling.
बीजीए पैकेजिंग तकनीक बेहतर थर्मल और विद्युत गुण प्रदान करती है।
अक्सर पूछे जाने वाले प्रश्न:
What is BGA packaging technology?
BGA (Ball Grid Array) is a high-density surface mount packaging technology with spherical pins arranged in a lattice pattern, offering better thermal and electrical performance compared to traditional packages.
बीजीए पीसीबी के क्या फायदे हैं?
बीजीए पीसीबी उच्च घनत्व, उत्कृष्ट गर्मी प्रवाहकता और कम प्रेरण क्षमता वाले तार प्रदान करते हैं, जो उन्हें उच्च गति वाले इलेक्ट्रॉनिक सर्किट और कॉम्पैक्ट डिजाइनों के लिए आदर्श बनाते हैं।
How is the BGA PCB assembly process conducted?
The process includes component procurement, PCB fabrication, precise component placement using pick-and-place machines, soldering (reflow or wave), inspection, testing, and final assembly to ensure quality and functionality.